Flip chip MEMS microphone package with large acoustic reference volume Proc. Eurosensors XXIV, September 5-8, 2010, Linz, Austria

Flip chip MEMS microphone package with large acoustic reference volume Proc. Eurosensors XXIV, September 5-8, 2010, Linz, Austria Feiertag, Gregor (DE-588)114909857 aut Pahl, Wolfgang (DE-588)113042345 aut Winter, Matthias (DE-588)109952553 aut Leidl, Anton (DE-588)106334948 aut Seitz, Stefan (DE-588)106801864 aut Siegel, Christian (DE-588)109007212 aut Beer, Andreas (DE-588)105929859 aut software, multimedia eng MEMS Mikrofon Procedia Engineering https://doi.org/10.1016/j.proeng.2010.09.121 urn:nbn:de:bvb:m347-dtl-0000000892

Flip chip MEMS microphone package with large acoustic reference volume Proc. Eurosensors XXIV, September 5-8, 2010, Linz, Austria

Feiertag, Gregor (DE-588)114909857 aut

Pahl, Wolfgang (DE-588)113042345 aut

Winter, Matthias (DE-588)109952553 aut

Leidl, Anton (DE-588)106334948 aut

Seitz, Stefan (DE-588)106801864 aut

Siegel, Christian (DE-588)109007212 aut

Beer, Andreas (DE-588)105929859 aut

software, multimedia

eng

MEMS

Mikrofon

Procedia Engineering https://doi.org/10.1016/j.proeng.2010.09.121

urn:nbn:de:bvb:m347-dtl-0000000892


Flip chip MEMS microphone package with large acoustic reference volume Proc. Eurosensors XXIV, September 5-8, 2010, Linz, Austria Feiertag, Gregor (DE-588)114909857 aut Pahl, Wolfgang (DE-588)113042345 aut Winter, Matthias (DE-588)109952553 aut Leidl, Anton (DE-588)106334948 aut Seitz, Stefan (DE-588)106801864 aut Siegel, Christian (DE-588)109007212 aut Beer, Andreas (DE-588)105929859 aut software, multimedia eng MEMS Mikrofon Procedia Engineering https://doi.org/10.1016/j.proeng.2010.09.121 urn:nbn:de:bvb:m347-dtl-0000000892